Problem & Solution
Over time, original thermal compounds on desktop CPUs, graphics cards, and game consoles degrade, dry out, and lose heat-transfer efficiency. This leads to higher chip operating temperatures, thermal throttling, decreased performance, and loud fan noise as the cooling fan struggles to keep up.
MJ Thermal Paste provides a thermal interface material with a rated conductivity of 12.4 W/mK. Designed to fill microscopic air gaps between the processor die/IHS and the heatsink thermal surface, it assists in conducting thermal energy rapidly to maintain manageable temperatures under heavy computing or gaming loads.
Who Is It For?
This product is targeted at PC builders, custom system integrators, console maintenance enthusiasts, and hardware repair technicians. It is suitable for anyone repasting a gaming desktop CPU, GPU die, or PS5 heat pipe assembly.
With quantity options ranging from 1g up to 30g, it serves both individual DIY users performing a single maintenance repaste and technicians who require larger quantities for continuous bench work.
Key Features
- 12.4 W/mK Thermal ConductivityFacilitates rapid heat dissipation from high-heat processor surfaces to the cooling heatsink
- Multiple Volume Options (1g, 4g, 8g, 15g, 30g)Allows buyers to order the precise amount required for single applications or bulk maintenance
- Broad Chipset CompatibilityFormulated for use on desktop CPUs, discrete GPU dies, and game console processors including the PS5
- Syringe Dispenser FormatEnables targeted application and convenient sealing between maintenance sessions
Technical Specifications
| Product Category | Thermal Conductive Grease / Interface Material |
| Thermal Conductivity | 12.4 W/mK |
| Available Net Quantities | 1g, 4g, 8g, 15g, 30g |
| Intended Devices | Gaming PC CPUs, GPUs, PS5 Consoles |
| Applicator Type | Syringe dispenser |
| Viscosity Rating | Not specified in available data |
| Operating Temperature Range | Not specified in available data |
| Electrical Conductivity | Not specified in available data |
Pros & Cons
Pros
- High manufacturer-rated thermal conductivity rating of 12.4 W/mK
- Versatile package options ranging from single-use 1g syringes to 30g bulk tubes
- Broad stated application compatibility covering PCs, GPUs, and PS5 console hardware
Cons
- Specific viscosity and density metrics are not provided in the available data
- Dielectric properties (electrical non-conductivity confirmation) are not explicitly specified in the product specs
- Package inclusions such as application spatulas or surface wipes are not specified
FAQ
A 1g or 4g tube is typically sufficient for standard desktop CPU applications, with plenty left over for re-application if needed. Larger 15g or 30g options are better suited for multi-system maintenance.
Yes, the product specifications list compatibility for PS5 cooling alongside traditional desktop CPUs and graphics cards.
The manufacturer lists a thermal conductivity rating of 12.4 W/mK for this compound.
Specific accessory inclusions beyond the thermal paste tube itself are not detailed in the available product information.
Final Verdict
A high-spec thermal interface compound on paper featuring a 12.4 W/mK rating and convenient sizing from 1g to 30g. It is a solid option for routine CPU, GPU, or console maintenance, provided you confirm your size requirements before purchase.